Thermal annealing effects on the structural and electrical properties of Ag2La thin films deposited by thermal evaporation technique

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dc.authorid0000-0001-8193-6975
dc.authorscopusid6603962677
dc.authorwosidR-4409-2019
dc.contributor.authorQasrawi Atef Fayez
dc.contributor.authorZakarneh Wafa
dc.date.accessioned2025-04-18T10:52:15Z
dc.date.available2025-04-18T10:52:15Z
dc.date.issued17.06.2024
dc.departmentİstinye Üniversitesi, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik-Elektronik Mühendisliği Bölümü
dc.description.abstractthermal annealing process. The thermally heated of films at 200 oC increased the crystallite sizes and improved the crystalline structure of the films. For these films the electrical conductivity measurements which were handled in the temperature range of 300- 440 K. The conductivity analyses indicated that the transport of charged particles is dominated by the thermionic emission and by the variable range hopping conduction mechanisms. The annealing of films shifted the impurity levels and decreased; the degree of disorder, the average hopping distance and the average hopping energy.
dc.identifier.doihttps://doi.org/10.15251/DJNB.2024.192.909
dc.identifier.endpage917
dc.identifier.issue2
dc.identifier.startpage909
dc.identifier.urihttps://hdl.handle.net/20.500.12713/7222
dc.identifier.volume19
dc.institutionauthorQasrawi, Atef Fayez
dc.institutionauthorid0000-0001-8193-6975
dc.publisherDigest Journal of Nanomaterials and Biostructures Vol. 19, No. 2, April - June 2024, p. 909 - 917
dc.relation.ispartofDigest Journal of Nanomaterials and Biostructures
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectAg2La
dc.subjectOrthorhombic
dc.subjectAnnealing
dc.subjectConductivity
dc.subjectVariable range hopping
dc.titleThermal annealing effects on the structural and electrical properties of Ag2La thin films deposited by thermal evaporation technique
dc.title.alternativeDigest Journal of Nanomaterials and Biostructures Vol. 19, No. 2, April - June 2024, p. 909 - 917
dc.typeArticle

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